SK Hynix reportedly in talks with Intel to build memory chips in US
South Korea's SK Hynix is reportedly in talks with Intel about making RAM chips in the United States, according to Reuters. SK Hynix told TechCrunch no decisions have been finalized as it evaluates multiple options, which may include leasing space at Intel's planned Ohio facility or forming a joint venture.
Why It Matters
A move to produce memory chips in the U.S. would expand domestic semiconductor capacity at a time of rising demand for AI-focused memory and heightened geopolitical scrutiny of chip supply chains. Such a deal could also trigger review under South Korean export-control rules if it involves sensitive technology.
Key Facts
- Reported discussions: Reuters reported SK Hynix and Intel are discussing U.S. RAM production (anonymous sources).
- Company comment: SK Hynix told TechCrunch no specific plans or arrangements have been finalized.
- Possible arrangements: Options discussed reportedly include leasing space at Intel's planned Ohio factory or a joint venture potentially involving cloud providers.
- Existing U.S. investment: SK Hynix is building a $3.8 billion advanced packaging and research facility in West Lafayette, Indiana, with mass production expected in 2029.
- Facility details: That Indiana factory will use DRAM wafers made in South Korea to package HBM chips.
South Korea’s SK Hynix has been reported to be in talks with Intel about producing RAM chips on U.S. soil, with Reuters citing unidentified sources. According to the report, the companies have explored multiple structures for a potential collaboration, including SK Hynix leasing manufacturing space at an Intel facility planned in Ohio or creating a joint venture that could involve cloud-service providers.
SK Hynix informed TechCrunch that it has not finalized any plans. The company said it is weighing various options to boost global competitiveness and that no decisions have been made regarding the scenarios described in media reports. Intel did not provide an immediate comment outside regular business hours.
The discussions come as SK Hynix is already expanding its U.S. footprint: the company is constructing a $3.8 billion advanced packaging and research plant in West Lafayette, Indiana, intended to begin mass production in 2029. That site is slated to package high-bandwidth memory (HBM) from DRAM wafers produced in South Korea. It remains unclear which specific types of memory chips, if any, would be manufactured in Ohio under the reported talks with Intel.
Any move to shift sensitive chip production overseas could draw scrutiny in South Korea. Authorities have said decisions rest with SK Hynix, but plans involving strategically important technology could trigger a government review under laws meant to prevent the transfer of sensitive capabilities. The potential U.S. production plan also aligns with broader U.S. policy pressures to expand domestic semiconductor manufacturing; the White House in January floated the possibility of wider tariffs on chip imports while offering tariff relief to firms that invest in U.S. facilities.
SK Group leadership has recently signaled openness to U.S. manufacturing: chairman Chey Tae-won indicated in July that the group should build factories in the United States if feasible, alongside facilities in South Korea’s Honam region. SK Hynix also listed American depositary receipts on the Nasdaq in July, widening its access to U.S. investors. The two companies have prior commercial history: Intel sold its NAND flash-memory business to SK Hynix in 2020 for $9 billion.
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